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OCZ - OCZ3RPX1333EB2GK (Our ITEM #: 745991)
2GB Kit DDR3 PC3-10666
Unit Price $333.01
Stock Available
5-8 Business Days: $8.35
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Volume Pricing
QtyUnit Price
1 ~ 2 $333.01
3 ~ 7 $329.99
8 ~ 14 $326.96
15 ~ 24 $323.93
25 or more $320.90
 
 Overview 
MODEL- OCZ3RPX1333EB2G    VEND0R- OCZ TECHNOLOGY
    
FEATURES- PC3-10666 ReaperX HPC Enhanced Bandwidth- 2GB Kit (2x1024MB)
       DDR3 PC3-10666/1333 MHz/ReaperX HPC/Enhanced Bandwidth/2GB Dual 
        Channel.
       1333 MHz DDR3, 6-5-5-18 (CAS-TRCD-TRP-TRAS), Dual Channel,
        Unbuffered, 1.85 Volts, 240-pin DIMM, ReaperX HPC Heatsink,
        1.9V EVP.
       The latest OCZ PC3-10666 ReaperX 2GB memory kits feature the ideal 
        blend of speed, latency, bandwidth, and up to 4GB capacities to 
        help DirectX-10 PC games reach their full potential on the latest 
        DDR3 platforms. PC3-10666 ReaperX 2GB kits are designed to help 
        deliver exceptional gaming visuals and overclocking potential, with 
        breakneck speeds and tight latencies coupled with advanced cooling 
        technology to ensure your high-powered gaming PC maintains 
        unsurpassed stability. 
       The ReaperX series provides enthusiasts leading-edge cooling 
        technology, with each memory chip in direct contact with a thermo-
        conductive pipe that guides heat away and quickly dissipates it 
        through the aluminum fin array. 
       As one of OCZ's legendary Enhanced Bandwidth (EB) editions, the 
        ReaperX 2GB kit increases effective memory bandwidth through the 
        optimization of memory latencies between the system memory, the 
        chipset, and memory controller, resulting in the ideal balance of 
        speed and enhanced timings. 
* ReaperX HPC (Heat Pipe Conduit) modules offload heat with extreme 
  efficiency due to a new dual copper heat pipe design. Each memory chip is 
  in direct contact with a thermo-conductive pipe that guides the 
  performance robbing heat away from key memory components and quickly 
  dissipates it through the aluminum fin array. The addition of the 
  extended fin array nearly doubles the total surface area available for 
  heat dissipation while the heat pipes warrant near isothermicity 
  throughout the entire design. The result is a doubling in effective heat 
  dissipation at equal delta t or, in real systems, a significantly lower 
  operating temperature of the memory modules. 
* OCZ EVP (Extended Voltage Protection) is a feature that allows 
  performance enthusiasts to use a VDIMM of 1.9V without invalidating their 
  OCZ Lifetime Warranty.
 www.ocztech.com
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