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OCZ - OCZ3P1600EB4GK (Our ITEM #: 739558)
4GB Kit 1600MHZ DDR3 PC3-12800
Unit Price $814.55
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5-8 Business Days: $10.65
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Volume Pricing
QtyUnit Price
1 ~ 2 $814.55
3 ~ 7 $807.15
8 ~ 14 $799.74
15 ~ 24 $792.34
25 or more $784.93
 
 Overview 
MODEL- OCZ3P1600EB4GK    VEND0R- OCZ TECHNOLOGY
    
FEATURES- DDR3 PC3-1800 Platinum Dual Channel EB Kit- 4GB (2x2048)
       1600 MHz, CL 7-6-6-24 (CAS-TRCD-TRP-TRAS), Unbuffered, Platinum Z3 
         XTC Heatspreader, 1.9 volts, 240-Pin DIMM, Optimized for ASUS
         Boards, 1.95V EVP.
       The PC3-12800 EB (Enhanced Bandwidth) Edition is built with ardent 
        enthusiasts in mind, featuring the ideal balance of sheer DDR3 
        speed and enhanced timings. This memory is specially designed and 
        optimized for the latest generation of ASUS motherboards. As one of 
        OCZ's legendary Enhanced Bandwidth (EB) editions, the ReaperX 4GB 
        kit increases effective memory bandwidth through the optimization 
        of memory latencies between the system memory, the chipset, and 
        memory controller, resulting in the ideal balance of speed and 
        enhanced timings. At 1600MHz, the PC2-12800 EB edition is rated for 
        7-6-6 timings on ASUS platforms. 
       OCZ Platinum DDR3-1600 modules will be available in 2x1024MB dual 
        channel kits. OCZ has been working closely with the leading 
        platform providers to ensure optimal performance and compatibility 
        on all the next generation computing platforms that will be 
        introduced later this year. 
       Each module is 100% hand-tested for quality assurance and 
        compatibility and features a proprietary platinum-mirrored XTC 
        (Xtreme Thermal Convection) heatspreader for the most effective 
        heat dissipation. As part of OCZ's line-up of premium memory, the 
        DDR3 series is backed by a Lifetime Warranty and industry-leading 
        technical support for unparalleled peace of mind. 
* XTC (Xtreme Thermal Convection) heatspreaders optimize the thermal 
  management of memory modules by promoting greater airflow by means of 
  micro-convection throughout what is usually the dead air space inside 
  conventional heatspreader designs. In this manner, build-up of heat is 
  avoided and thermal dissipation of the memory components is offloaded 
  more efficiently through the honeycomb design. At the same time, 
  mechanical stability is maintained. 
* OCZ EVP (Extended Voltage Protection) is a feature that allows 
  performance enthusiasts to use a VDIMM of 1.95V without invalidating 
  their OCZ Lifetime Warranty.
 www.ocztech.com
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