MODEL- OCZ2N1066SR2GK     VEND0R- OCZ TECHNOLOGY
    
FEATURES- DDR2 PC2-8500 SLI-Ready Edition Dual Channel- 2GB Kit (2x1024MB)
       DDR2 PC2-8500/1066MHz/NVIDIA SLI-Ready Edition/Dual Channel!
       1066MHz DDR2, EPP 5-5-5-15 (CAS-TRCD-TRP-TRAS), Unbuffered, 
        SLI-Ready XTC Heatspreader, 2.3 Volts, 240-Pin DIMM, NVIDIA SLI
        certified, 2.35V EVP.
       The OCZ PC2-8500 SLI-Ready Series is equipped with NVIDIA Enhanced 
        Performance Profiles (EPP) to optimize the modules' performance on 
        nForce SLI-based motherboards. OCZ exclusively engineered select 
        high-performance modules with advanced SPD (Serial Presence Detect) 
        settings to allow compatible motherboards to recognize and utilize 
        the added information, ultimately increasing the performance 
        potential of the entire platform. 
       OCZ SLI-Ready memory modules are programmed to boot at 1066MHz DDR2 
        with supremely fast timings of 5-5-5. Only motherboards equipped 
        with the custom-designed BIOS, such as those designed for NVIDIA 
        nForce SLI MCPs, can detect the optimized SPD profiles and ensure 
        the memory functions under the best possible conditions. The 
        exclusive OCZ SPD specifications take out the guesswork and provide 
        enthusiasts and gamers with significant overclocked performance 
        with no manual adjustment or compatibility issues. 
       Each OCZ SLI-Ready module comes equipped with an exclusive NVIDIA 
        XTC heatspreaders for the most efficient heat dissipation and a 
        look that stands out like its performance. Additionally, all SLI-
        Ready memory is backed with toll-free technical support, the 
        exclusive EVP (Extended Voltage Protection) coverage, and an 
        industry leading Lifetime Warranty. 
       With the fusion of the sophisticated EPP memory specification and 
        cutting-edge, high-speed OCZ DDR2 architecture, the PC2-8500 
        edition is the ultimate breakthrough for advanced SLI platform 
        performance.
* XTC (Xtreme Thermal Convection) heatspreaders optimize the thermal 
  management of memory modules by promoting greater airflow by means of 
  micro-convection throughout what is usually the dead air space inside 
  conventional heatspreader designs. In this manner, build-up of heat is 
  avoided and thermal dissipation of the memory components is offloaded 
  more efficiently through the honeycomb design. At the same time, 
  mechanical stability is maintained. 
* OCZ EVP (Extended Voltage Protection) is a feature that allows 
  performance enthusiasts to use a VDIMM of 2.35V +/- 5% without 
  invalidating their OCZ Lifetime Warranty.
 www.ocztech.com