This thermal interface compound is developed by Shin Etsu Chemical Co., Ltd. to meet the current and future requirements of high performance microprocessors. It is used to increase surface contact area for heat transfer by minimizing any air bubbles that exists between the top of the processor and the base of the heat sink. Cooler Master specifically designed this application kit to give you professional results every time and instantly, as it would come off the production line.

Specification

Color: Gray

Viscosity: 1700 Poise

Density: Over 2.0 @ 20

Thermal Conductivity: 6.8 W/mK

Temp Usage: -50 to 170

Storage Temperature: Under 10